Find the issue you are experiencing in the troubleshooting tips below. The various possible causes are listed, identify which is causing your specific issue and correct accordingly.

Edgebanding pulls off easily by hand. Hot melt adhesive remains on the chipboard. The grid pattern of the glue application roller is visible.

• Not enough adhesive applied
• Room temperature too low
• Edgebanding material too cold (stored outdoors)
• Hot melt adhesive temperature too low
• Feed rate too low
• Too little pressure applied by application roller

Edgebanding pulls off easily by hand. Hot melt adhesive remains on the chipboard. Hot melt adhesive surface totally smooth (Edgebanding slips off).

• Board and/or Edgebanding too cold
• Check hot melt adhesive type
• Check application of bonding agent
• Hot melt adhesive largely remains on the Edgebanding

Temperature of board material too high as a result of previous processing (e.g., veneering). Adhesive joint not closed (Edgeband gluing machine).

• Too little pressure applied
• Adhesive too cold
• Increase application temperature or preheat board or increase feed rate

Edgebanding either not or reverse pretensioned. Glue joint not closed (machining centre).

• Too little pressure applied
• Edgebanding was fed in too cold and cannot be squeezed
• Edgebanding material restoring force too high
• Increase heater power or reduce feed rate
• Increase geometry or use a thinner Edgebanding
• Adhesive not suited for use in machine centres, adhesion under heat too low

Edgebanding is bonded only at the edges.

• Too little pressure applied
• Milled joint on board hollow
• Edgebanding pretensioning too high
• Inadequate bonding of the glued Edgebanding at the face side of the board, or the Edgebanding is chipped on the face side due to misaligned adhesive application roller

Not enough adhesive applied due to misaligned glue application roller.

• Apply more adhesive

Milling waves are visible.

• Feed rate too high
• Cutting speed of cutters too low
• Re-process with scrapers and buffing; cut against the feed
• Increase number of cutters on router bit
• Increase rpm

On thick Edgebanding, the color fades slightly in the milled areas (stress whitening).

• Warm up milled area with hot-air station (can be retro-fitted)
• Scraper blade chips too thick
• Rework on buffing station
• Reduce scraper blade chip thickness (max. 0.1 – 0.2 mm)

Evidence of stress whitening in radius during machine centre processing.

• Edgebanding fed in too cold
• Increase heater power or reduce feed rate
• Increase geometry or use a thinner Edgebanding material

Adhesive stringy after application.

• Reduce application temperature
• Clean gluing part
• Test using different adhesive

So-called “mice teeth” in the joint.

• Apply more adhesive
• Increase application temperature
• Preheat board

Breakout of longitudinal edges after cross-edging.

• Only format MDF board and use
• Check the router for immersion depth
• Reduce material removal or use different chipboard

Edgebanding surface print damaged during machine centre processing.

• Use special rubber rollers

Indentations or scratches in the Edgebanding.

• Clean Edgebanding draw-in
• Clean press rollers and spray with separating agent
• Clean scanning head; if this does not help, then check scanning head for damage and replace if necessary

Breakouts or smears at Edgebanding ends.

• Sharpen cross-cut saw
• Ask the tool manufacturer for a suitable tool

Breakouts on top and bottom edges.

• Reduce Edgebanding overhang
• Acclimatize Edgebanding and boards one day prior to processing (over 18°C)
• Increase room temperature and prevent draught

Edgebanding smears when copying.

• Reduce number of blades
• Control rpm
• Mill Edgebanding against the feed
• Increase feed rate

3D 2in1 offset in corners.

• Accurately set Edgebanding downholder
• Minimise Edgebanding overhang
• Check that Edgebanding is straight